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产品类型 (PrOductType) |
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单面板／双面板／多层板3-12层 (Singleside／doubleside／mutilayer3-12 layers) |
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常用基材 (BaseMaterial) |
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高频板材(HF Base Material)、FR-4、CEM-3 |
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陶瓷板材 (Ceramic basic material) |
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板厚度(Board Thckness)
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内层芯 0.15-1.50mm(Inner core) |
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总厚度 0.20-3.50mm(Toral Thickness) |
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板厚公差 (Tolerance of Board Thickness) |
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内层芯最大公差 ±0.08mm(lnner Core Thickness) |
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总厚度公差 ±0.15mm(Tolerance of total board thickness) |
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铜箔厚度 17-175 um(Copper Foil Thickness) |
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最大加工面积 800 X 500mm(MaX.Unit Area) |
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最小产品面积 2 x 10mm(Min.Unit Area)
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最小孔径 0.3mm/12mmil(Min.Hole Size) |
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最小线宽 0.127mm／5mil (Min.Line Width)
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最小间距 0.127mm／5mil (Min.Space)
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阻焊油墨 (Tamura)Dsr一2200 (NANIA) LP-3G (Solder Mask) |
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外形加工精度 0.15mm(Precision of Outling)
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表面处理 (SurfaCeTreatment) |
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喷锡(Solder Coating) (Gold．Nickel Plting) 镀.镆金(Electroness Au) 沉金 沉银、 OSP涂覆 |
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(Cobalt／Gold Plating，Hard Gold)镀钴／全(硬金) |
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内层对位公差 ±0.10mm (Tolersnce of lnner Aqaist Outerlayer) |
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生产能力 10000平方米／月(month)， 360平方米／日(day) |
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交货周期 样品2-3天 批量5-8天 The company is committed to the supply of samples with in 2-3 days and mass
production |
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